PRINTED CIRCUIT BOARD MOUNTING METHOD

PROBLEM TO BE SOLVED: To improve a soldering pattern in a through-hole printed substrate. SOLUTION: Cream solder is supplied to a through-hole and an eyelet part surface land by a print method and soldering is carried out by flow. At the same time, cream solder is dissolved by using conduction heat...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI ATSUSHI, KUBOTA FUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve a soldering pattern in a through-hole printed substrate. SOLUTION: Cream solder is supplied to a through-hole and an eyelet part surface land by a print method and soldering is carried out by flow. At the same time, cream solder is dissolved by using conduction heat from flow to the through-hole land. In the method, soldering of the part surface land is carried out stably and surely. COPYRIGHT: (C)2005,JPO&NCIPI