SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve the characteristics of a semiconductor device having the inductance of a wiring for a wiring board by the reduction of the inductance. SOLUTION: Bonding leads BRa, in which at least parts of plane patterns are superposed (containing even the cases of contacts) and bu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUWA MOTOHIRO, YOSHIKAWA YASUHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve the characteristics of a semiconductor device having the inductance of a wiring for a wiring board by the reduction of the inductance. SOLUTION: Bonding leads BRa, in which at least parts of plane patterns are superposed (containing even the cases of contacts) and bump electrodes BPa, are connected electrically through surface wiring L1a, through-holes THa and rear wiring L2a. Consequently, the superpositions of the surface wiring L1a and the rear wiring L2a are increased, the mutual inductances of these pieces of the wiring can be enlarged and the effective inductances of the wiring can be reduced. COPYRIGHT: (C)2005,JPO&NCIPI