METHOD FOR PRODUCING INTEGRATED CIRCUIT DIE

PROBLEM TO BE SOLVED: To eliminate wire bonds required in prior art, and to provide an integrated circuit package while the integrated circuit is still in a wafer format. SOLUTION: A method that eliminates wire bonds required in prior art provides the integrated circuit package while the integrated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ANDERSON JAMES, GERSHON AKARLING
Format: Patent
Sprache:eng
Schlagworte:
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