SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent an entire semiconductor device from becoming large, while enhancing heat radiation effects without limiting the form of a radiating member. SOLUTION: The semiconductor device is constituted by being provided with a metal insul...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMOKAWA MOTOMARE, ONISHI HIROYUKI, ISHIKAWA JUN, AKAGAWA KOICHI, NAGASE TOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent an entire semiconductor device from becoming large, while enhancing heat radiation effects without limiting the form of a radiating member. SOLUTION: The semiconductor device is constituted by being provided with a metal insulating substrate 74 consisting of a base plate 71, an insulating layer 72 and a conductor 73, a semiconductor chip 75 which is formed above the metal insulating substrate 74, wiring 77 which electrically connects the semiconductor chip 75 and an electrode 76, a heat spreader 11 which is formed between the metal insulating substrate 74 and the semiconductor chip 75 for absorbing and radiating heat generated at the semiconductor chip 75, and a heat spreader 12 which is formed on the heat spreader 11 so as to cover the semiconductor chip 75. COPYRIGHT: (C)2005,JPO&NCIPI