MULTICHIP MODULE

PROBLEM TO BE SOLVED: To provide a multichip module mounting structure using inexpensive lead-free metallic balls which have corrosion resistance even when the balls are not plated and have shock absorbing properties and are excellent in sphericity even when the balls have sizes of >1 mm. SOLUTIO...

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Bibliographische Detailangaben
Hauptverfasser:	NAKATSUGI YASUTO, HATAKEYAMA AKIHITO, WATANABE MASAKI, TAKATORI MASAHIRO, ISHII MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multichip module mounting structure using inexpensive lead-free metallic balls which have corrosion resistance even when the balls are not plated and have shock absorbing properties and are excellent in sphericity even when the balls have sizes of >1 mm. SOLUTION: A multichip module 6 is connected to a mother substrate 5 through the metallic balls 4. The metallic balls 4 are made of a brass material, and the solder used for connecting the metallic balls 4 to the mother substrate 5 or the metallic balls 4 to the multichip module 6 is lead-free solder. COPYRIGHT: (C)2005,JPO&NCIPI