MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component capable of assuring a heat dissipation from a heat radiating plate of the electronic component to a heat dissipation member and capable of avoiding a dielectric breakdown by electric discharge. SOLUTION: In the status w...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	UMEMOTO SATORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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