MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component capable of assuring a heat dissipation from a heat radiating plate of the electronic component to a heat dissipation member and capable of avoiding a dielectric breakdown by electric discharge. SOLUTION: In the status w...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	UMEMOTO SATORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component capable of assuring a heat dissipation from a heat radiating plate of the electronic component to a heat dissipation member and capable of avoiding a dielectric breakdown by electric discharge. SOLUTION: In the status where an insulating bushing 4 is inserted in a mounting hole 2a of a radiating plate 2 of the electronic component and an insulating sheet 3 intervenes between the radiating plate 2 and a radiation fin 1, a screw 5 is screwed in a screw hole 1a of the radiation fin 1 from the mounting hole 2a of the radiating plate 2. There is provided a spot facing portion 6 at an opening of the screw hole 1a. The insulating bushing 4 is projected inside the spot facing portion 6 by penetrating the radiating plate 2 and the insulating sheet 3, and a through-hole 3a through which the insulating bushing 4 in the insulating sheet 3 passes is made smaller than an opening of the spot facing portion 6. COPYRIGHT: (C)2005,JPO&NCIPI