WAFER MOVING DEVICE

PROBLEM TO BE SOLVED: To move half the number of wafers, at a time, which are accommodated in a carrier into another carrier (separation), and to move all of one separated half of the wafers, at a time, into a single carrier which accommodates another separated half of the wafers (integration). SOLU...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUKUNAGA MITSUHIRO, HONDA TOSHIYUKI
Format: Patent
Sprache:eng
Schlagworte:
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