WAFER MOVING DEVICE

PROBLEM TO BE SOLVED: To move half the number of wafers, at a time, which are accommodated in a carrier into another carrier (separation), and to move all of one separated half of the wafers, at a time, into a single carrier which accommodates another separated half of the wafers (integration). SOLU...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUKUNAGA MITSUHIRO, HONDA TOSHIYUKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To move half the number of wafers, at a time, which are accommodated in a carrier into another carrier (separation), and to move all of one separated half of the wafers, at a time, into a single carrier which accommodates another separated half of the wafers (integration). SOLUTION: In the case of separation, a carrier 2a accommodating a plurality of wafers 1 is located on a mount 3a, and an empty carrier 2b is located on a mount 3b. The carrier 2a is vertically lifted up by a predetermined distance to deviate from the empty carrier 2b. The wafers 1 in the carrier 2a, which stand facing the empty carrier 2b as a result of the deviation, are moved into the empty carrier 2b by means of a push plate 9. In the case of integration, two carriers each accommodating a plurality of wafers are located on the mounts, respectively. One carrier is vertically lifted up by a predetermined distance for deviation from the other carrier. All of the wafers in the other carrier are moved into the one carrier at a time by means of the push plate for integration with the wafers in the one carrier. COPYRIGHT: (C)2005,JPO&NCIPI