MOUNTING STRUCTURE FOR MULTI-CHIP MODULE

PROBLEM TO BE SOLVED: To provide a mounting structure for multi-chip module in which the area of a substrate can be reduced by mounting chip components in a BGA nonexisting area on the connecting face of the substrate. SOLUTION: In this mounting structure for multi-chip module, chip components 3, su...

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Bibliographische Detailangaben
Hauptverfasser:	NAKATSUGI YASUTO, HATAKEYAMA AKIHITO, WATANABE MASAKI, ISHII MASAHIRO, TAKATORI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting structure for multi-chip module in which the area of a substrate can be reduced by mounting chip components in a BGA nonexisting area on the connecting face of the substrate. SOLUTION: In this mounting structure for multi-chip module, chip components 3, such as resistors, capacitors, etc., are used as connecting materials between substrates. Since the chip components 3 maintain the distance between a multi-chip module 1 and a substrate 2 at a fixed value, the area of the substrate can be reduced by mounting the chip components 3 in the BGA nonexisting area on the connecting face of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI