ADHESIVE TAPE FOR ELECTRONIC PARTS

PROBLEM TO BE SOLVED: To solve the following problem: a reflow process is generally used in a mounting process by mounting an IC to a leadframe, wire bonding and mold encapsulating the same and mounting the same to a substrate, package cracks are generated at an interface between the leadframe and a...

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Bibliographische Detailangaben
Hauptverfasser:	SEI AKIKUNI, HASHIMOTO TAKESHI, YAMAZAKI HIRONOBU, NAKABA KATSUJI, TOCHIHIRA JIYUN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve the following problem: a reflow process is generally used in a mounting process by mounting an IC to a leadframe, wire bonding and mold encapsulating the same and mounting the same to a substrate, package cracks are generated at an interface between the leadframe and a molded resin caused by vaporization of water included in the package by heat. SOLUTION: The adhesive tape for electronic parts is prepared by laying an adhesive layer at least on one surface of a heat resistant film. The adhesive layer has a composition comprising (a) an acrylonitrile-butadiene copolymer, (b) a p-t-butylphenol type resol phenol, (c) a compound having ≥2 maleimide groups and (d) a diamine compound or a polysiloxane compound having amino groups on both ends and 200-7,000 weight average molecular weight. COPYRIGHT: (C)2005,JPO&NCIPI