LOAD LOCK WITH TEMPERATURE REGULATION, LITHOGRAPHY SYSTEM EQUIPPED WITH LOAD LOCK, AND METHOD FOR PRODUCING SUBSTRATE USING LOAD LOCK

PROBLEM TO BE SOLVED: To provide a load lock with temperature regulation, a lithography system equipped with a load lock, and a method for producing a substrate using the load lock. SOLUTION: An object, e.g. a substrate W, is transferred into/from a lithography system. Load lock outer walls 38 and 4...

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Hauptverfasser: KUIPERS LEO W M, KLOMP ALBERT JAN HENDRIK, FRANSSEN JOHANNES HENDRIKUS GERTRUDIS, HOOGKAMP JAN FREDERIK, VISSER RAIMOND, VULLINGS HENRICUS J L M, VUGTS JOSEPHUS CORNELIUS JOHANNES ANTONIUS
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a load lock with temperature regulation, a lithography system equipped with a load lock, and a method for producing a substrate using the load lock. SOLUTION: An object, e.g. a substrate W, is transferred into/from a lithography system. Load lock outer walls 38 and 40 define at least a part of the load lock volume for containing support units 33 and 141 which support the object W when it is in the load lock. Furthermore, the load lock has a structure for temperature regulation to control the temperature of the object at least before it is transferred from the load lock toward the lithography system. COPYRIGHT: (C)2005,JPO&NCIPI