METHOD AND DEVICE FOR INSPECTING SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide a method and a device for inspecting semiconductor wafer by which LSI (large-scale integrated circuit) chips can be prevented from being judged as defective chips due to the imperfect contact between a contact pad and a probe during the course of an LSI chip test. SOLUTION: The method includes a step (S1) of performing a contact test by bringing the probe into contact with a first position in the contact pad with a first pressure, steps (S4-S11) of detecting a second position other than the first position in the contact pad from an image picked up from the contact pad (S3) when an LSI chip is discriminated as a defective chip as a result of the contact test performed on the first position (S2), and steps (S12-S14) of performing another contact test by bringing the probe into contact with the second position in the contact pad with a second pressure higher than the first pressure. COPYRIGHT: (C)2005,JPO&NCIPI