SUBSTRATE PROCESSING DEVICE AND ITS PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing device and its processing method in which a treating agent to a substrate can be classified for recycling and an exhausting force can be efficiently utilized. SOLUTION: The substrate processing device 10 has a retaining base 20 for retaining a wafer W rotatably, a nozzle 40 for supplying chemical liquids L1, L2 to the wafer W, and a pot 30 which is disposed in an outer periphery of the retaining base 20 for recovering the chemical liquids L1, L2 scattered from the wafer W. The pot 30 contains a lid 70 movable in an axial direction of the retaining base 20, to form a plurality of chemical liquid recovery grooves M1, M2 internally by changing the position of the lid 70. COPYRIGHT: (C)2005,JPO&NCIPI