SOLAR CELL

PROBLEM TO BE SOLVED: To provide a solar cell that can prevent cracking of a semiconductor substrate during manufacture. SOLUTION: A front-side electrode 3 is adhered to the surface 2 of a silicon board 1. A surface-side tab 4 is soldered to the surface 2 and the front-side electrode 3. A rear-side...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSURUTA AKIZO, YASUDA JUNICHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a solar cell that can prevent cracking of a semiconductor substrate during manufacture. SOLUTION: A front-side electrode 3 is adhered to the surface 2 of a silicon board 1. A surface-side tab 4 is soldered to the surface 2 and the front-side electrode 3. A rear-side electrode 7 is adhered to the rear surface 6 of the silicon board 1 by heating and baking. The rear-side electrode 7 is provided with a base electrode 9 including a plurality of holes 8, and a plurality of land electrodes 10 arranged in the respective holes 8. A rear-side tab 11 is soldered to the land electrode 10. The thickness of the surface-side tab 4 is adjusted so as to offset the warpage of the silicon board 1 generated by soldering of the surface-side tab 4 and the warpage thereof generated by baking of the rear-side electrode 7 and soldering of the rear-side tab 11. COPYRIGHT: (C)2005,JPO&NCIPI