ETCHING EQUIPMENT

ETCHING EQUIPMENT

PROBLEM TO BE SOLVED: To eliminate unevenness at the time of etching an ingot. SOLUTION: In the equipment 10 which is immersed and performs etching of the ingot 16 in an etchant tub 17, a cage 15 for mounting the ingot 16 is formed which has arcuate side on at least one portion of the external surfa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SATO HIROYUKI, KASHIWASE MASAKAZU, HANEKI YOSHIAKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To eliminate unevenness at the time of etching an ingot. SOLUTION: In the equipment 10 which is immersed and performs etching of the ingot 16 in an etchant tub 17, a cage 15 for mounting the ingot 16 is formed which has arcuate side on at least one portion of the external surface. A recessed arcuate side which lays arcuate side of the ingot 16 in a bottom wall 15a of the top of the cage 15 is established. The cage 15 is dipped in the etchant tub 17, and rocked with a rocking means 14, thereby performing tumbling of the ingot 16. COPYRIGHT: (C)2005,JPO&NCIPI