SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent stacked semiconductor packages from being stripped while preventing displacement thereof at the time of secondary packaging. SOLUTION: In semiconductor packages PK1 and PK2 bonded through bump electrodes 13, resin 15 is placed on a semiconductor chip 3 such that at l...

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Bibliographische Detailangaben
1. Verfasser: AOYANAGI TETSUTOSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent stacked semiconductor packages from being stripped while preventing displacement thereof at the time of secondary packaging. SOLUTION: In semiconductor packages PK1 and PK2 bonded through bump electrodes 13, resin 15 is placed on a semiconductor chip 3 such that at least a part of the semiconductor chip 3 is exposed and then the semiconductor packages PK2 is bonded to the semiconductor chip 3 through the resin 15. COPYRIGHT: (C)2005,JPO&NCIPI