ULTRASONIC BONDING DEVICE

PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device which is capable of improving an ultrasonic horn in both control accuracy in the direction of a Z axis and bonding properties and shortening a time required for carrying out bonding to reduce the electronic components, such as a chip or the like, in cost. SOLUTION: The ultrasonic bonding device is equipped with an ultrasonic horn 12 which gives a prescribed pressure and ultrasonic vibrations to the chip 14, a Z stage 19 mounted with the ultrasonic horn 12 on its lower end, and a Z slide 11 which positions the Z stage 19 in a freely movable manner. A motor 16 is provided to the Z slide 11, the revolutions of the motor 16 are converted to a rectilinear motion by a pole screw mechanism 18 to move the Z stage 19 rectilinearly, a piezoelectric device P and a pressure detector 34 are arranged between the Z stage 19 and the ultrasonic horn 12, and the piezoelectric device P is expanded or contracted to feed the ultrasonic horn 12 finely on the basis of the detection signals of the pressure detector 34. COPYRIGHT: (C)2005,JPO&NCIPI