BONDING METHOD BY USING THERMOSETTING EPOXY COMPOSITION

PROBLEM TO BE SOLVED: To provide a bonding method which enables to control easily and freely a thickness of the glue line without causing internal perfection and spark even if one partner of the adherends is of a metal. SOLUTION: The method for bonding the adherends 1, 2, in which one or both of the...

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Bibliographische Detailangaben
Hauptverfasser:	DAITOKU TETSUO, HARADA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a bonding method which enables to control easily and freely a thickness of the glue line without causing internal perfection and spark even if one partner of the adherends is of a metal. SOLUTION: The method for bonding the adherends 1, 2, in which one or both of them are of metals, by a dielectric heating process and by using an epoxy composition which has the main component of an epoxy resin with not less than two epoxy groups and comprises one or more kinds of liquids and also is curable with a hardener and by heating, is characterized in that glass beads are contained in the bonding agent layer 3 of the thermosetting epoxy resin. COPYRIGHT: (C)2005,JPO&NCIPI