EPOXY RESIN COMPOSITION AND ITS USE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which gives a semiconductor device sealed with a resin having high heat resistance and a low elastic modulus at high temperatures. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin represented by formula (1) (wherein Ar1and...

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Hauptverfasser:	NAGASHIMA TORU, SAITO NORIAKI, KIM DAIKO, KO ZENSHU, LEE SHOJUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition which gives a semiconductor device sealed with a resin having high heat resistance and a low elastic modulus at high temperatures. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin represented by formula (1) (wherein Ar1and Ar2are each independently a 6-20C aromatic group; GEO is a glycidyl ether group; R1to R4are each independently hydrogen, a 1-20C alkyl group, a 5-20C cycloalkyl group or a 7-20C aralkyl group; and R1and R3are not simultaneously hydrogens and R2and R4are not simultaneously hydrogens), (B) a curing agent having a phenolic hydroxyl group, and (C) an inorganic filler. COPYRIGHT: (C)2005,JPO&NCIPI