CERAMIC CIRCUIT BOARD AND ELECTRICAL CIRCUIT MODULE

PROBLEM TO BE SOLVED: To provide a highly reliable ceramic circuit board and an electrical circuit module, having a simple structure and superior heat dissipation performance, where its ceramic board will not be damaged, even if subjected to heat cycle between high and low temperatures. SOLUTION: Ce...

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Bibliographische Detailangaben
Hauptverfasser:	TERASONO HIROBUMI, ITO NOBUYUKI, YAKUBO KIYOSHI, TERAO SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a highly reliable ceramic circuit board and an electrical circuit module, having a simple structure and superior heat dissipation performance, where its ceramic board will not be damaged, even if subjected to heat cycle between high and low temperatures. SOLUTION: Ceramic boards 33 are bonded to both the surfaces of a metal circuit plate 31, a concave part 37 is formed in the ceramic board 33a so that the metal circuit plate 31 is exposed, and an electrical device 35 is mounted on the metal circuit plate 31 exposed to the concave part 37. COPYRIGHT: (C)2005,JPO&NCIPI