SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To facilitate assembling work while reducing the size and cost. SOLUTION: A substrate 2 and a main power electrode 3 are formed of one copper member where a thick part serves as the substrate 2 and a thin part serves as the main power electrode 3. A semiconductor element 5 is bonded to the upper surface of the substrate 2 and connected electrically with the main power electrode 3 through the substrate 2. A control electrode 4 is arranged closer to the main power electrode 3 side than the semiconductor element 5 on the upper surface of the substrate 2 and connected with the semiconductor element 5 by a bonding wire 9. The main power electrode 3 is parallel with the substrate 2 before being assembled and is bent, during assembling work, to the upper surface side substantially perpendicularly to the substrate 2. COPYRIGHT: (C)2005,JPO&NCIPI