SOCKET SUBSTRATE FOR TEST OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To solve the problem of a contact failure of an electrode terminal for a test and various problems resulting therefrom, in the test of a semiconductor device. SOLUTION: Socket terminals to each electrode in the semiconductor device are divided, and a conduction confirmation means is provided between the divided socket terminals, and a rotation vibration means is imparted to the socket terminals, and a blowout or suction mechanism of the air is provided in a gap of the divided socket terminals. This substrate has a conduction confirmation function and a conduction recovery function, and removes efficiently adhesion or deposit on the socket terminals. COPYRIGHT: (C)2005,JPO&NCIPI