DRY FLUIDIZED POLISHING METHOD

PROBLEM TO BE SOLVED: To provide a dry fluidized polishing method for improving polishing performance without increasing a rotational peripheral speed even in a conventional device scale. SOLUTION: This dry fluidized polishing method polishes a work by rubbing the polishing work and polishing media,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSUCHIIE KAZUYO, SUZUKI SHOICHIRO, ARITA SATORU, FUKUI YOICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a dry fluidized polishing method for improving polishing performance without increasing a rotational peripheral speed even in a conventional device scale. SOLUTION: This dry fluidized polishing method polishes a work by rubbing the polishing work and polishing media, by moving the polishing media, the polishing work, or both of these, by embedding the polishing work in these polishing media, by filling the polishing media in a treating tank; and is characterized by polishing the work by setting a rate of the volume of the polishing media and the volume of the work to 4 or more : 1, setting a rate of a width of the polishing media and a width of the work to 1.2 to 5 : 1, and setting a rate of the height of the polishing media and the height of the work to 1.2 or more : 1. This polishing method efficiently converts rotational kinetic energy of the work into frictional energy of the work and the polishing media, provides large frictional force even if the rotational peripheral speed is not increased, and also provides high polishing performance stable over a long period. COPYRIGHT: (C)2005,JPO&NCIPI