CAPACITOR AND ITS PRODUCING PROCESS
PROBLEM TO BE SOLVED: To provide a wiring board in which noise can be removed surely by incorporating a capacitor and the inductance of wiring can be lowered, and to provide an inexpensive wiring board capable of incorporating a capacitor having a high capacitance. SOLUTION: The wiring board 100 inc...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a wiring board in which noise can be removed surely by incorporating a capacitor and the inductance of wiring can be lowered, and to provide an inexpensive wiring board capable of incorporating a capacitor having a high capacitance. SOLUTION: The wiring board 100 incorporates a capacitor 20 in a recess 11 formed in a core substrate body 10 and provided with resin insulating layers 41-43 and 51-53 and wiring layers 45, 46, 55 and 56 above and below the capacitor 20. The capacitor 20 can be connected vertically through pads 21 and 22 on the upper surface 20A and lower surface 20B and when a bottom through hole conductor 12 connected with the pad 21 or 22 is connected with the wiring layers 45 and 55, it is connected with a flip-chip pad 101 or an LGA pad 103 through a large number of upper capacitor connecting lines 60 or lower capacitor connecting lines 70. COPYRIGHT: (C)2005,JPO&NCIPI |
---|