BONDING METHOD

PROBLEM TO BE SOLVED: To provide a bonding method capable of bonding articles, each having a bonding surface cleaned with energy wave, readily and surely and capable of sustaining a target bonding state even in case of mass production. SOLUTION: In the method for bonding articles each having a metal...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAUCHI AKIRA, HARAI TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a bonding method capable of bonding articles, each having a bonding surface cleaned with energy wave, readily and surely and capable of sustaining a target bonding state even in case of mass production. SOLUTION: In the method for bonding articles each having a metal bonding part on the surface of a substrate by cleaning the bonding face of each metal bonding part with energy wave and then bonding the metal bonding parts to each other, parallelism between the articles being bonded is measured previously for at least one article or one group of articles. Parallelism is adjusted based on the measurements and both articles are aligned before the metal bonding parts thereof are bonded. COPYRIGHT: (C)2005,JPO&NCIPI