LABEL WITH IC CHIP PACKAGE
PROBLEM TO BE SOLVED: To provide a label having an IC chip package which is inexpensive and hard to break. SOLUTION: The label with the IC chip package is provided with an IC chip package opposing releasing part 3y which is at least substantially as long as the label of the IC chip package 22 in the...
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| creator | NAGURA TOSHIKAZU |
| description | PROBLEM TO BE SOLVED: To provide a label having an IC chip package which is inexpensive and hard to break. SOLUTION: The label with the IC chip package is provided with an IC chip package opposing releasing part 3y which is at least substantially as long as the label of the IC chip package 22 in the longitudinal direction, and an adhesive agent face exposed by removing the release paper of the releasing part is adhered to the face 1y which is substantially opposite to the IC chip bonded face of the release paper part on which the IC chip package is bonded. Thus, the label is hard to break since the release paper is free from a slit at least near the IC chip package opposing releasing part. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
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SOLUTION: The label with the IC chip package is provided with an IC chip package opposing releasing part 3y which is at least substantially as long as the label of the IC chip package 22 in the longitudinal direction, and an adhesive agent face exposed by removing the release paper of the releasing part is adhered to the face 1y which is substantially opposite to the IC chip bonded face of the release paper part on which the IC chip package is bonded. Thus, the label is hard to break since the release paper is free from a slit at least near the IC chip package opposing releasing part. 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SOLUTION: The label with the IC chip package is provided with an IC chip package opposing releasing part 3y which is at least substantially as long as the label of the IC chip package 22 in the longitudinal direction, and an adhesive agent face exposed by removing the release paper of the releasing part is adhered to the face 1y which is substantially opposite to the IC chip bonded face of the release paper part on which the IC chip package is bonded. Thus, the label is hard to break since the release paper is free from a slit at least near the IC chip package opposing releasing part. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JP2004317544A |
| source | esp@cenet |
| subjects | ADVERTISING BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING CRYPTOGRAPHY DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR DISPLAY DISPLAYING EDUCATION FILES HANDLING RECORD CARRIERS LABELS OR NAME-PLATES LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEALS SIGNS SPECIAL PRINTED MATTER TRANSPORTING |
| title | LABEL WITH IC CHIP PACKAGE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-15T06%3A53%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAGURA%20TOSHIKAZU&rft.date=2004-11-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2004317544A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |