LABEL WITH IC CHIP PACKAGE
PROBLEM TO BE SOLVED: To provide a label having an IC chip package which is inexpensive and hard to break. SOLUTION: The label with the IC chip package is provided with an IC chip package opposing releasing part 3y which is at least substantially as long as the label of the IC chip package 22 in the...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a label having an IC chip package which is inexpensive and hard to break. SOLUTION: The label with the IC chip package is provided with an IC chip package opposing releasing part 3y which is at least substantially as long as the label of the IC chip package 22 in the longitudinal direction, and an adhesive agent face exposed by removing the release paper of the releasing part is adhered to the face 1y which is substantially opposite to the IC chip bonded face of the release paper part on which the IC chip package is bonded. Thus, the label is hard to break since the release paper is free from a slit at least near the IC chip package opposing releasing part. COPYRIGHT: (C)2005,JPO&NCIPI |
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