METAL MASK AND LEAD-FREE SOLDER PASTE PRINTING METHOD USING IT

PROBLEM TO BE SOLVED: To realize excellent soldering by preventing the reduction of connection strength caused by the deterioration (oxidization) of a flux in a lead-free solder paste printing method using the solder including tin as the main component and silver, the solder including tin as the mai...

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Bibliographische Detailangaben
Hauptverfasser: KOMAMIZU SHIYUUICHI, MORI TAKAYUKI, MAKINO KAZUMI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To realize excellent soldering by preventing the reduction of connection strength caused by the deterioration (oxidization) of a flux in a lead-free solder paste printing method using the solder including tin as the main component and silver, the solder including tin as the main component and silver and copper or the like. SOLUTION: A circuit substrate (2) is provided with an electrode (21) for connecting the tip part of the lead member (6). Two openings (11a, 11b) are formed at the position corresponding to the position of the electrode (21) on the circuit substrate (2) to a metal mask (1). The shapes of the two openings (11a, 11b) are respectively circular or elliptical. Two lead-free solder paste patterns (30a, 30a), which are arranged in the direction of pulling out from the electrode (21) to the other circuit, are printed by using the metal mask (1). COPYRIGHT: (C)2005,JPO&NCIPI