CLEANING OF ELECTRONIC DEVICE

CLEANING OF ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an improved system to polish and clean a lead-frame substrate after molding for the purpose of removing stains generated by mold flushing or bleeding. SOLUTION: For the treatment of an electronic device, and particularly for the purpose of forming and cleaning the de...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KUAH TENG HOCK, PANG HUN KHOON, HO SHU CHUEN, ZHAO BAO ZONG, LEE SHUAI GE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an improved system to polish and clean a lead-frame substrate after molding for the purpose of removing stains generated by mold flushing or bleeding. SOLUTION: For the treatment of an electronic device, and particularly for the purpose of forming and cleaning the device, equipment and methods are provided. The forming equipment is used to seal the electronic device with molding materials. After that, stain removal is performed using stain removal equipment which is configured so that an polishing agent is closely attached to the electronic device through one or more surfaces of the electronic device. Finally, a residual material removal system removes residual materials from the one or more surfaces of the electronic device. COPYRIGHT: (C)2005,JPO&NCIPI