ELECTRONIC CIRCUIT UNIT

PROBLEM TO BE SOLVED: To provide an electronic circuit unit which is miniaturized and enables firm soldering of a cover. SOLUTION: The unit has a circuit substrate 1 wherein an electronic component 3 is mounted on its upper surface 1a, a land part 4 for wiring provided to a lower surface 1b of the c...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YAMAMOTO YUKIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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