ELECTRONIC CIRCUIT UNIT

PROBLEM TO BE SOLVED: To provide an electronic circuit unit which is miniaturized and enables firm soldering of a cover. SOLUTION: The unit has a circuit substrate 1 wherein an electronic component 3 is mounted on its upper surface 1a, a land part 4 for wiring provided to a lower surface 1b of the circuit substrate 1 and a box-shaped cover 7 wherein its leg part 7b is soldered to the circuit substrate 1. The circuit substrate 1 has a housing part provided for inserting the leg part 7b of the cover 7 and an electrode part 6 which is provided to a wall surface of the housing part with an upper end part 6a not reaching the upper surface 1a. Since the leg part 7b is soldered to the electrode part 6 being inserted to the housing part from an upper surface side, a usual conductive pattern provided to an upper surface of an outer circumferential part of a cut-out portion is unnecessary, thus enlarging a wiring area in the upper surface 1a and realizing miniaturization. COPYRIGHT: (C)2005,JPO&NCIPI