METHOD FOR FORMING METALLIC FILM GRAPHICAL PATTERN

PROBLEM TO BE SOLVED: To provide a graphic pattern forming method capable of surely forming a graphic pattern even when the thickness of a metallic film is thick as 1 to 30μm. SOLUTION: In the pattern forming method for forming a graphic pattern on a substrate by using the lift-off method, a negativ...

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Bibliographische Detailangaben
1. Verfasser:	GONDA MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a graphic pattern forming method capable of surely forming a graphic pattern even when the thickness of a metallic film is thick as 1 to 30μm. SOLUTION: In the pattern forming method for forming a graphic pattern on a substrate by using the lift-off method, a negative photo resist film is formed on the substrate, the graphical pattern is formed, thereafter a metallic film is formed on the entire face of the substrate, then a positive photo resist film is formed on the graphic pattern of the metallic film, the metallic film other than that configuring the graphic pattern is removed by etching, and then the substrate is dipped in a solvent to exfoliate the resist. COPYRIGHT: (C)2005,JPO&NCIPI