BUMP FLATTENING DEVICE, BUMP FLATTENING METHOD, AND BUMP BONDING UNIT

BUMP FLATTENING DEVICE, BUMP FLATTENING METHOD, AND BUMP BONDING UNIT

PROBLEM TO BE SOLVED: To enable a large number of gold bumps formed on a substrate, such as a wafer or the like, to be shaped well and made uniform in height. SOLUTION: The wafer 40 where the bumps are provided on its top surface is placed on a mounting stand 16, the heads of the gold bumps on the w...

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Bibliographische Detailangaben
1. Verfasser: SUMIYA OSAMU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To enable a large number of gold bumps formed on a substrate, such as a wafer or the like, to be shaped well and made uniform in height. SOLUTION: The wafer 40 where the bumps are provided on its top surface is placed on a mounting stand 16, the heads of the gold bumps on the wafer 40 are pressed down with the lower end of a rotating roller 18, and the mounting stand 16 is horizontally and relatively moved to the rotating roller 18. At this point, the mounting stand 16 is moved at such a speed that the relative speed of the mounting stand 16 to the lower part of the rotating roller 18 becomes nearly zero. COPYRIGHT: (C)2005,JPO&NCIPI