RE-MOLDING METHOD FOR RESIN MATERIAL AND SORTING DEVICE FOR RESIN MATERIAL PULVERIZED PIECE

PROBLEM TO BE SOLVED: To provide a re-molding method for a resin material capable of effectively increasing a coating film removal ratio (recovery ratio of pulverized pieces having no coating film adhered to the entire pulverized pieces to be processed) in a short period of time without taking time...

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Bibliographische Detailangaben
Hauptverfasser:	FUJI KAZUHISA, IKEDA NORIMASA, MORIWAKI KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	CRUSHING, PULVERISING, OR DISINTEGRATING CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL DETECTING MASSES OR OBJECTS GEOPHYSICS GRAVITATIONAL MEASUREMENTS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MAKING GRANULES OR PREFORMS MEASURING MILLING GRAIN OTHER SEPARATING BY DRY METHODS APPLICABLE TO BULK MATERIAL,e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL PERFORMING OPERATIONS PHYSICS POSTAL SORTING PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PREPARATORY TREATMENT OF GRAIN FOR MILLING RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SEPARATING SOLIDS FROM SOLIDS SEPERATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, ORSIFTING OR BY USING GAS CURRENTS SORTING SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a re-molding method for a resin material capable of effectively increasing a coating film removal ratio (recovery ratio of pulverized pieces having no coating film adhered to the entire pulverized pieces to be processed) in a short period of time without taking time in a coating film peeling/separation process and increasing a material yield by preparing the pulverized pieces after pulverization and coating film peeling of coated resin molded products, then detecting and deciding the presence/absence of coating film adhesion for each pulverized piece, separating the pulverized piece having the adhered coating film from the pulverized piece group having no adhered coating film on the basis of the above decided result and performing molding by using the pulverized piece group having no adhered coating film after separation. SOLUTION: The re-molding method for the resin material comprises: preparing processes S1-S3 of preparing the pulverized pieces after the pulverization and coating film peeling of the coated resin molded products; a discrimination process S5 of detecting and deciding the presence/absence of the coating film adhesion for each pulverized piece after the preparing processes S1-S3; a separating process S6 of separating the pulverized piece having the adhered coating film from the pulverized piece group having no adhered coating film on the basis of the decided result; and a molding process S8 of performing molding by using the pulverized piece group having no adhered coating film after the separation process S6. COPYRIGHT: (C)2005,JPO&NCIPI