Sn-COATED COPPER OR COPPER ALLOY MEMBER AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a copper or copper alloy member which has an inexpensive coating excellent in electric reliability, leakage resistance, corrosion resistance, solderability and heat resistance on the surface which has been exposed through molding of copper or a copper alloy material into a desired shape. SOLUTION: On at least a part of the surface which has been exposed through molding of the copper or copper alloy member 14 into the desired shape, an Ni-containing layer 16 with a thickness of 0.1-5 μm is formed, a Cu-containing layer 18 with a thickness of 0.2-3 μm is formed on the Ni-containing layer 16, and an Sn-containing layer 20 with a thickness of 0.2-10 μm is formed on the Cu-containing layer 16 to achieve a ratio (thickness ratio of Cu/Sn) of the thickness of the Sn-containing layer 20 to the thickness of the Cu-containing layer 18 of ≤2. After forming the Ni-containing layer 16, the Cu-containing layer 18 and the Sn-containing layer 20 through electroplating, the member is subjected to heating and melting or dipped into molten Sn. COPYRIGHT: (C)2005,JPO&NCIPI