METHOD FOR PLATING ELECTRONIC COMPONENT

METHOD FOR PLATING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method for plating an electronic component by which a yield can be improved. SOLUTION: The method for plating an electronic component is provided with: a stage where the object to be plated is stored into a cylindrical barrel 4; a stage where the barrel 4 is dipped...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIKAMOTO NAOHIRO, HAYASE JUNICHI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for plating an electronic component by which a yield can be improved. SOLUTION: The method for plating an electronic component is provided with: a stage where the object to be plated is stored into a cylindrical barrel 4; a stage where the barrel 4 is dipped into a plating liquid 1 stored in a plating tank 2; and a stage where a plating layer is formed on the object to be plated while the barrel 4 is being rotated. By vibrating the barrel 4 in the process of the formation of the plating layer, the cohesion between the electronic components with each other can be reduced, so that the yield can be improved. COPYRIGHT: (C)2005,JPO&NCIPI