RESIN-SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent the peeling generated in the interface between a relaxation resin and a sealing resin, in a resin-sealed semiconductor device wherein its electronic element having a surface coated with the relaxation resin is so supported on its substrate as to mold the whole thereof by the sealing resin. SOLUTION: In the contacting portion of a first relaxation resin 18a with a ceramic substrate 11, a first peeling preventing resin comprising a different resin from the first relaxation resin 18a is so disposed as to surround by it the periphery of the first relaxation resin 18a. By such a configuration, even though a peeling occurs in the interface between the first relaxation resin 18a and a sealing resin 17, the occurred peeling can be prevented from so propagating through the first relaxation resin 18a on the surface of the ceramic substrate 11 as to cause cracks and disconnections in wires 16a, 17a. As a result, since there is no necessity for using thick wires in the wires 16a, 17a in consideration of their applied stresses caused by the peeling, the narrowing of the pitches of electrode pads to be connected with the wires 16a, 17a can be realized. COPYRIGHT: (C)2005,JPO&NCIPI