METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of reducing deformation such as a warp. SOLUTION: The manufacturing method comprises the steps of blowing an air 21 including micro particles to the surface of an object 19 to be processed with glass members 1...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HONMA FUMIHIRO, TANIFUJI AKIHITO
Format:	Patent
Sprache:	eng
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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