METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of reducing deformation such as a warp. SOLUTION: The manufacturing method comprises the steps of blowing an air 21 including micro particles to the surface of an object 19 to be processed with glass members 18 formed, polish removing an insulating film 14 positioned between the glass members 18, continuously blowing the air 21 including the micro particles between the glass members 18 even after the surface of the substrate 15 is exposed, and polish removing the surface to reduce the warp of the object 19 to be processed by the collision of the micro particles. Consequently, even the warp of the object 19 to be processed occurs in the step for forming the glass members 18, the processing is eliminated in the step for removing the insulating film 14, which can manufacture the semiconductor device having a small deformation. COPYRIGHT: (C)2005,JPO&NCIPI