SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HIRATA OTOHIKO, HATTORI NORIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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