SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit...

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Hauptverfasser: HIRATA OTOHIKO, HATTORI NORIFUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit board 1 in which the circuit conductor 3 of the thickness of 120 μm or more is formed into the predetermined pattern on at least one surface of an insulating substrate 2, is filled with a groove filling agent 5, and a solder resist film 4 is formed on the surface of the circuit conductor 3 and the agent 5. The difference (t1-t2) between the thickness t1 of the circuit conductor 3 and the total thickness t2 of the agent 5 between the circuit conductor 3 and the film 4 is set at 80 μm or less. COPYRIGHT: (C)2005,JPO&NCIPI