SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit...

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Hauptverfasser: HIRATA OTOHIKO, HATTORI NORIFUMI
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HIRATA OTOHIKO
HATTORI NORIFUMI
description PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit board 1 in which the circuit conductor 3 of the thickness of 120 μm or more is formed into the predetermined pattern on at least one surface of an insulating substrate 2, is filled with a groove filling agent 5, and a solder resist film 4 is formed on the surface of the circuit conductor 3 and the agent 5. The difference (t1-t2) between the thickness t1 of the circuit conductor 3 and the total thickness t2 of the agent 5 between the circuit conductor 3 and the film 4 is set at 80 μm or less. COPYRIGHT: (C)2005,JPO&NCIPI
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2004296465A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2004296465A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2004296465A3</originalsourceid><addsrcrecordid>eNrjZPAM9vdxcQ1SCHIN9gwOUXDz9PFVcPMP8vX0c1dw9gxyDvUMUXDydwxyUXD0c1HwdfQLdXN0DgkNAsn7uoZ4-LsohHi4Brn6u_EwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDAxMjSzMTM1NHY6IUAQCNli2d</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>HIRATA OTOHIKO ; HATTORI NORIFUMI</creator><creatorcontrib>HIRATA OTOHIKO ; HATTORI NORIFUMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit board 1 in which the circuit conductor 3 of the thickness of 120 μm or more is formed into the predetermined pattern on at least one surface of an insulating substrate 2, is filled with a groove filling agent 5, and a solder resist film 4 is formed on the surface of the circuit conductor 3 and the agent 5. The difference (t1-t2) between the thickness t1 of the circuit conductor 3 and the total thickness t2 of the agent 5 between the circuit conductor 3 and the film 4 is set at 80 μm or less. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20041021&amp;DB=EPODOC&amp;CC=JP&amp;NR=2004296465A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20041021&amp;DB=EPODOC&amp;CC=JP&amp;NR=2004296465A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRATA OTOHIKO</creatorcontrib><creatorcontrib>HATTORI NORIFUMI</creatorcontrib><title>SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</title><description>PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit board 1 in which the circuit conductor 3 of the thickness of 120 μm or more is formed into the predetermined pattern on at least one surface of an insulating substrate 2, is filled with a groove filling agent 5, and a solder resist film 4 is formed on the surface of the circuit conductor 3 and the agent 5. The difference (t1-t2) between the thickness t1 of the circuit conductor 3 and the total thickness t2 of the agent 5 between the circuit conductor 3 and the film 4 is set at 80 μm or less. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAM9vdxcQ1SCHIN9gwOUXDz9PFVcPMP8vX0c1dw9gxyDvUMUXDydwxyUXD0c1HwdfQLdXN0DgkNAsn7uoZ4-LsohHi4Brn6u_EwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDAxMjSzMTM1NHY6IUAQCNli2d</recordid><startdate>20041021</startdate><enddate>20041021</enddate><creator>HIRATA OTOHIKO</creator><creator>HATTORI NORIFUMI</creator><scope>EVB</scope></search><sort><creationdate>20041021</creationdate><title>SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</title><author>HIRATA OTOHIKO ; HATTORI NORIFUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2004296465A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRATA OTOHIKO</creatorcontrib><creatorcontrib>HATTORI NORIFUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRATA OTOHIKO</au><au>HATTORI NORIFUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</title><date>2004-10-21</date><risdate>2004</risdate><abstract>PROBLEM TO BE SOLVED: To provide a solder resist film forming circuit board whose circuit conductor has a thickness of 120 μm or more, in which a satisfactory solder resist film is formed even on an edge portion of the circuit conductor. SOLUTION: A groove between a circuit conductor 3 of a circuit board 1 in which the circuit conductor 3 of the thickness of 120 μm or more is formed into the predetermined pattern on at least one surface of an insulating substrate 2, is filled with a groove filling agent 5, and a solder resist film 4 is formed on the surface of the circuit conductor 3 and the agent 5. The difference (t1-t2) between the thickness t1 of the circuit conductor 3 and the total thickness t2 of the agent 5 between the circuit conductor 3 and the film 4 is set at 80 μm or less. COPYRIGHT: (C)2005,JPO&amp;NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SOLDER RESIST FILM FORMING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T08%3A37%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIRATA%20OTOHIKO&rft.date=2004-10-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2004296465A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true