CONDUCTIVE PASTE AND CERAMIC MULTILAYERED CIRCUIT BOARD USING CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To provide conductive paste and a ceramic multilayered circuit board using the conductive paste, capable of forming a fine line, preventing the occurrence of warp or disconnection in wiring even when baked together with a ceramic green sheet, and lowering an electric resistance...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA SADAHIRO, SUEHIRO MASATOSHI, OGURA SHINICHI, NISHIKAWA MASAHITO, OCHI HIROSHI, SHIBATA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide conductive paste and a ceramic multilayered circuit board using the conductive paste, capable of forming a fine line, preventing the occurrence of warp or disconnection in wiring even when baked together with a ceramic green sheet, and lowering an electric resistance value. SOLUTION: Ag particles having an average particle size of 0.3-5.0 μm and covered with an inorganic oxide are dispersed in an organic vehicle. COPYRIGHT: (C)2005,JPO&NCIPI