METHOD FOR MEASURING DEGREE OF ETCHING

PROBLEM TO BE SOLVED: To provide a method and a device capable of exactly obtaining an etching degree during and/or after an etching process independently of an etching method of a material. SOLUTION: The method and the device for obtaining the etching degree of the material 25 by arranging detector...

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Bibliographische Detailangaben
Hauptverfasser:	GHOZEIL ADAM, BARNES TED W, SUDYKA WILLIAM J, CHAVARRIA VICTORIO, EMERY TIMOTHY R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTION OF TYPOGRAPHICAL ERRORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LINING MACHINES MEASURING METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PHYSICS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TESTING TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and a device capable of exactly obtaining an etching degree during and/or after an etching process independently of an etching method of a material. SOLUTION: The method and the device for obtaining the etching degree of the material 25 by arranging detector elements 60 and 72 adjacently to a part of the material 25 to be etched are provided. The element widths W1 and W2 varies. The resistance of the detector element is measured during etching of a part. COPYRIGHT: (C)2005,JPO&NCIPI