METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which realizes reduction of the developing period of a product and improvement of an yield at an early stage in addition to reduction of mistakes in work by automating a branching process. SOLUTION: In initial registration, a work-starting condition to be a reference from a work-starting condition by preceding processing and that by APC and an instructed variation is set to each wafer performing branching. Thus, when the construction of each wafer is started by the device, a work-starting condition value corresponding to the selected work-starting condition is automatically obtained (S402), a numerical value obtained by adding the instructed variation to the work-starting condition value is instructed automatically (S403), and the construction of each wafer is started (S404 to S406). COPYRIGHT: (C)2005,JPO&NCIPI