ADHESIVE TAPE

PROBLEM TO BE SOLVED: To provide an adhesive tape which is capable of preventing an adhesive agent from transferring to a dicing frame from its part where the dicing frame is pasted and excellent in releasability at an interface between an adhesive agent layer and a base film when a chip is separate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AOGAKI TOMOYUKI, KANO YOSHIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive tape which is capable of preventing an adhesive agent from transferring to a dicing frame from its part where the dicing frame is pasted and excellent in releasability at an interface between an adhesive agent layer and a base film when a chip is separated from its other part where a wafer is pasted on. SOLUTION: An adhesive agent layer is provided, at least, on one surface of the base film, and a separator is provided on the adhesive agent layer side for the formation of the semiconductor wafer dicing-bonding adhesive tape that is used in a bonding process of manufacturing a semiconductor device. The adhesive agent is formed into a single layer, and the adhesive tape is composed of one part where the adhesive agent layer and the base film layer are set separable from each other and the adhesive agent layer is easily transferred to an adherend, and the other part where the adhesive agent layer and the base film layer are hardly separated from each other and the adhesive agent layer is hardly transferred to the adherend. COPYRIGHT: (C)2005,JPO&NCIPI