SEMICONDUCTOR SUBSTRATE, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR SUBSTRATE, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To manufacture a semiconductor device which is small in element thickness and has high performance. SOLUTION: A semiconductor substrate is equipped with a first substrate of a first thickness and a second substrate of a second thickness larger than the first thickness, and the...

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Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUESHIRO TOMOKO, FUDA MASANORI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To manufacture a semiconductor device which is small in element thickness and has high performance. SOLUTION: A semiconductor substrate is equipped with a first substrate of a first thickness and a second substrate of a second thickness larger than the first thickness, and the second substrate is formed along the circumferential part of the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI