WAVE SOLDERING METHOD OF LIGHT EMITTING DIODE SURFACE-MOUNTED

PROBLEM TO BE SOLVED: To give high lighting to an instrument needle of an installment cluster. SOLUTION: This installment cluster is constituted to inform an occupant of a working state of a vehicle and has a housing to support the cluster, and the housing is devised to be mounted on an installment...

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Hauptverfasser: CORRION WESLEY R, GHEORGHIU ADRIAN G, HERNANDEZ RICARDO, ROVIK CHRISTOPHER L
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To give high lighting to an instrument needle of an installment cluster. SOLUTION: This installment cluster is constituted to inform an occupant of a working state of a vehicle and has a housing to support the cluster, and the housing is devised to be mounted on an installment panel of the vehicle. A circuit board is fixed on the housing. A motor is fixed on the circuit board, a motor shaft is connected to the motor free to rotate and the instrument needle is mounted on the motor shaft. Additionally, this installment cluster has at least one diode to light the instrument needle and furthermore, it further has at least one diode foot print to electrically connect this diode to the circuit board. COPYRIGHT: (C)2005,JPO&NCIPI