SERIES OF ELECTRONIC COMPONENTS

PROBLEM TO BE SOLVED: To provide a series of electronic components which is received in a cavity and can be surely taken out by a suction nozzle or the like of an automatic packaging machine wherein an electronic component at an initial end of the series in particular can be surely taken out. SOLUTI...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NAKAGAWA SEISHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a series of electronic components which is received in a cavity and can be surely taken out by a suction nozzle or the like of an automatic packaging machine wherein an electronic component at an initial end of the series in particular can be surely taken out. SOLUTION: The series of electronic components 1 includes an elongate carrier tape 2 having a plurality of cavities 2a dispersedly formed along the longitudinal direction, chip-type electronic components 3 received in the cavities 2a respectively, and a cover film 4 stuck to the carrier tape to cover the cavities 2a. The carrier tape 2 is equipped with cavity center detection marks 5a and 5b in a predetermined positional relation with respect to the center of the cavity 2a at least at the initial end. COPYRIGHT: (C)2004,JPO&NCIPI